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Fully Automatic Single Wafer Cleaning Equipment

Fully Automatic Single Wafer Cleaning Equipment

ItemSpecification
Application FieldRCA cleaning, pre-deposition cleaning, post-etch cleaning, post-CMP cleaning, wet etching, pre-EPI cleaning, etc.
Equipment Configuration

4~16 chambers (customizable)

Supports 2~4 CST/SMIF/FOUP loading/unloading

Supports automatic chemical supply system CCSS, LCSS

Heating control, concentration control, flow control, pressure control, etc.;

Separate exhaust for acid, alkali, and organic solutions;

Supports chemical recycling;

High-definition camera, E-FLOW (optional);

Fully supports SECS/GEM communication protocol

Wafer Size100mm~300mm
Process IndicatorsEtching uniformity: Within-wafer: <3%; Wafer-to-wafer: <3%; Lot-to-lot: <3%;
Particle ControlAdded particles <20 counts @0.2μm (tested with silicon oxide film, incoming particles <50 counts)
Metal Ions<5E9 atoms/cm2

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